HDI Board General Information

High Density Interconnects (HDI) board is another kind of board (PCB).
They have finer lines and spaces ( and capture pads (300, than employed in conventional
PCB technology. HDI board is used to reduce size and weight, as well
as to enhance electrical performance.
According to layer up different, currently DHI board is divided into 2 basic types:

1) HDI PCB (1+N+1)

Features:
• Suitable for BGA with lower I/O counts
• Qualified material and surface treatment for Lead-free process
• Excellent mounting stability and reliability
• Copper filled via
Application: Cell phone, UMPC, MP3 Player, PMP, GPS, Memory Card
1+N+1 HDI PCB Structure:

2) HDI PCB (2+N+2)

Features:
• Suitable for BGA with higher I/O counts
• Increase routing density in complicated design
• Thin board capabilities
• Lower Dk / Df material enables better signal transmission performance
• Copper filled via
Application: Cell phone, PDA, UMPC, Portable game console, DSC